Langdao Silex has unveiled a prototype EUV lithography light source, with the company estimating that commercial production remains 3–5 years away.
ASML will increase prices for all lithography equipment components by 10% starting in January 2027, impacting major clients Samsung and SK hynix.
ASML and Carl Zeiss have begun developing the Hyper NA lithography system, which aims to enable 5 nm feature printing and improve resolution by over one-third.
ASML and ZEISS plan to launch Hyper NA EUV lithography systems with 0.75 NA and 5nm resolution within the next decade, citing depth of focus as the main technical challenge.
ASML and Carl Zeiss are developing Hyper NA lithography, a next-generation technology expected to reduce chip feature sizes by over 38 percent within the next decade.
Huawei is developing domestic EUV lithography technology while utilizing its proprietary LogicFolding 3D packaging to maintain performance without advanced manufacturing nodes.
Huawei is developing domestic EUV lithography equipment and implementing the 'tau law' strategy to boost chip performance without relying on shrinking transistor sizes alone.
Huawei executive Yu Chengdong stated that China is actively developing EUV lithography equipment while utilizing 'Logic Folding' technology to bypass current manufacturing limitations.
Gigaphoton has launched an ArF laser neon recycling system capable of saving 470 kilolitres of gas annually, as chipmakers prioritize supply chain stability.
Russia's ZNTC has completed a 130nm-capable lithography prototype, supported by $70 million in state funding, with commercial deployment expected no earlier than 2029.
Chinese chipmakers have amassed 343 ASML lithography systems, with imports exceeding $13 billion in 2024 and 2025 to support 7nm production.
Chinese companies have acquired over 340 immersion DUV lithography systems from ASML, spending more than $13 billion to support domestic 7-nm chip production.
ASML reported zero revenue from the European market in the first half of 2026, citing a lack of investment and new semiconductor factory construction in the region.
Dutch startup Morphotonics has raised €40 million to scale production of its nanoimprint lithography technology and enter the data center market.
Chinese researchers have developed a method to produce 3nm-class GAA transistors using existing DUV lithography, circumventing restrictions on advanced EUV equipment.
The startup Terafab faces a trademark lawsuit from Tera-print, a firm that has utilized the Tera-Fab brand for lithography tools for over ten years.
ASML maintains its focus on laser-produced plasma technology for EUV lithography, targeting 1000W power output while dismissing the immediate viability of free-electron laser alternatives.
The Chinese Academy of Sciences has developed a GAA transistor architecture that could enable 3 nm-class performance using existing DUV lithography tools.
Nvidia CEO Jensen Huang predicts that China will develop its own advanced lithography equipment by 2030, despite ongoing international restrictions on semiconductor manufacturing technology.
Nvidia CEO Jensen Huang expects China to develop advanced lithography equipment by 2030, potentially reducing reliance on foreign suppliers like ASML.
