Langdao Silex has publicly unveiled a prototype of its own EUV lithography light source. The company claims that 90 percent of the system components are manufactured domestically in China, with most core units developed in-house.
The FlintNano LPP-OXXO low-power unit utilizes laser-produced plasma technology. Its specifications include a 1000 W drive laser, a pulse frequency of 1–20 kHz, and a conversion efficiency exceeding 2 percent. The system delivers over 15 W of EUV output power.
The company reports a plasma brightness of 100 W/(mm²·sr), a plasma size of 60 μm, and continuous operation capability exceeding 100 hours. Stability metrics are rated at 3 percent RMS for plasma and 5 percent for energy.
While the FlintMicro-LPP high-power series has passed initial technology verification, the FlintNano-LPP series remains in the product development phase. Langdao Silex estimates that full-scale commercial production is still 3–5 years away.
Significant engineering challenges remain, specifically regarding output power scaling and long-term stability. Industrial-grade EUV systems typically require hundreds of watts of power, whereas ASML achieved 250 W in 2018 and demonstrated a 1000 W source in 2025.
