Canon has announced the upcoming release of the FPA-6400ES6a, a KrF scanning lithography system designed for memory and logic chip manufacturing. The machine is scheduled to go on sale in early December 2026.
The system features a newly developed high-acceleration stage, enabling a production capacity of 400 wafers per hour. Canon has implemented advanced vibration suppression and thermal control technologies to achieve an overlay accuracy of 4.0nm.
The equipment includes an optional Hi-ALS light source for its image alignment system, allowing manufacturers to select optimal wavelengths for various processes. Additionally, the machine can handle wafer warpage up to 700μm by adjusting vacuum suction flow.
To improve energy efficiency, the FPA-6400ES6a utilizes a power control system that captures regenerative energy during stage deceleration to reuse it during acceleration. This design, combined with a high-efficiency power supply, reduces overall power consumption per wafer.
