Chinese startup Langdao Silex has introduced the FlintNano LPP-OXXO, a homegrown extreme ultraviolet lithography laser source. The system utilizes laser-produced plasma technology to generate EUV radiation, mirroring the approach employed by ASML. According to the company, approximately 90% of the components used in the system are developed or sourced domestically.
The FlintNano system features a 1,000 W driving laser with repetition rates ranging from 1 to 20 kHz. It delivers an EUV output exceeding 15 W and achieves a conversion efficiency of over 2%. The manufacturer reports that the equipment is capable of continuous operation for more than 100 hours. The current prototype is intended for wafer exposure testing, though it requires further technical refinement.
The development of a light source represents only one component of a full EUV scanner. Building such a machine requires additional complex technologies, including precise reflective optics and advanced wafer positioning mechanisms. Currently, China remains restricted from importing EUV lithography tools due to export bans enforced since 2019 under pressure from the United States government.
