Samsung Seeks to Expand AMD Partnership into Chip Manufacturing
Samsung is negotiating with AMD to expand their partnership beyond HBM memory supply to include contract chip manufacturing services.

Samsung is negotiating with AMD to expand their partnership beyond HBM memory supply to include contract chip manufacturing services.

AMD CEO Lisa Su met with Samsung co-CEO Jun Young-hyun in Seoul to discuss strategic cooperation across a broad range of technology sectors.

Foundry CEO Mike Colyer is stepping down after seven years, as the Bitcoin mining infrastructure firm undergoes a 60 percent workforce reduction.

TSMC plans to raise prices for advanced wafers by 6–8% in early 2027, citing rising costs and high demand for its 2nm production capacity.
Samsung Electronics aims to quadruple its foundry client count by 2029 while shifting its core focus toward high-performance computing and AI applications.

Intel aims to narrow the performance gap with TSMC's 1.4-nanometer A14 process to under 5 percent with its upcoming 14A node.

Samsung is planning to expand its 4nm and 2nm foundry capacity to support the rising demand for HBM base dies and new processor production.

TSMC solidified its dominance in the global foundry market, capturing 73% of revenue in Q2 2026 as AI demand and advanced node production fueled significant financial growth.

Intel is currently having its advanced 14A semiconductor process evaluated by major tech firms, including Apple, Nvidia, and Microsoft, as it seeks to challenge the current market dominance.

Samsung has launched trial production of 2nm AI5 chips for Tesla at its new Texas facility, moving ahead of the original schedule.

DB HiTek has qualified its 1,200 V SiC MOSFET process on 8-inch wafers and plans to launch volume production in 2027.

Intel CEO Pat Gelsinger calls for diversifying chip manufacturing away from TSMC as CPU demand outstrips supply amid the rise of AI agents.

Intel CEO Pat Gelsinger reported that the company can currently fulfill only 50% of CPU demand as it seeks to expand its foundry business and compete in AI chip manufacturing.

Intel plans to reach a monthly production capacity of 6,000 wafers for its 14A process by late 2027, while the 18A node has reportedly achieved an 80% yield.

Samsung Foundry is dedicating half of its 4nm production capacity to HBM4 base dies to meet growing demand for custom logic integration.
