Samsung Electronics is evaluating the construction of new production lines for its 4nm and 2nm process nodes. The company aims to increase manufacturing capacity to meet the growing demand for advanced base dies used in HBM memory modules.
The memory division at Samsung has confirmed that the upcoming HBM4 generation will utilize 4nm base dies, while the subsequent HBM5 memory will transition to 2nm technology. Custom HBM solutions also require high-performance base dies, which necessitates advanced manufacturing capabilities.
Currently, half of Samsung's 4nm foundry capacity is dedicated to producing HBM4 base dies. This demand is expected to rise as HBM4 shipments accelerate and production of AI chips, such as the NVIDIA Groq 3, continues to expand.
Regarding the 2nm process, Samsung plans to integrate more Exynos processors, designed by its System LSI division, into its Galaxy S and Z series smartphones. Additionally, the foundry division has secured orders from major external clients, including Tesla.
