Intel CEO Lip-Bu Tan recently held discussions with AMD CEO Lisa Su regarding potential areas for collaboration between the two companies. While the specific details of these talks remain undisclosed and no formal partnership has been announced, industry observers suggest that cooperation could involve foundry services, software development, or advanced chip packaging solutions.
During a discussion with the Chinese American Semiconductor Professional Association on October 24, Tan outlined a strategic shift for Intel. The company aims to regain its leadership in the CPU market by customizing products like Xeon processors to meet specific customer requirements. This marks a departure from previous internal policies regarding product design and client engagement.
Intel is focusing on growth areas such as ASICs, co-packaged optics, physical AI, and advanced packaging. The company targets that two or three of these sectors will eventually contribute approximately 10 percent of its total revenue. These initiatives are part of a broader effort to improve the company's financial and market standing.
On the manufacturing front, Intel has reached volume production for its 18A process node. The company is also advancing its 14A node, having released the 0.5 PDK. The 0.9 version is expected to follow, with the 1.0 version slated for volume production early next year. Intel previously aimed to provide the 0.9 PDK to external customers in October.
