Samsung is seeking to expand its partnership with AMD, aiming to transition the company from a primary buyer of HBM memory into a major client for its contract chip manufacturing division, Samsung Foundry. This strategic shift is intended to strengthen Samsung's competitive position against TSMC in the semiconductor foundry market.
The companies are building upon a three-year memorandum of understanding signed in March 2026. The agreement covers the supply of HBM4 and DDR5 memory, joint development of AI and high-performance computing solutions, and collaboration on advanced chip packaging technologies.
AMD currently utilizes Samsung Foundry and UMC for the production of specific programmable logic integrated circuits. However, transitioning advanced processor and accelerator designs to a new foundry involves significant technical challenges, including potential risks to product yield, performance, and release timelines.
Currently, the partnership is centered on memory supply, with Samsung serving as the primary provider of HBM4 for AMD Instinct MI400 accelerators. AMD has also commenced shipments of its new Instinct MI455 accelerators, which feature 432 GB of HBM4, alongside Helios rack systems.
