TSMC has commenced mass production of 5x reticle size advanced packaging and is actively developing solutions reaching up to 14x to meet growing demand for AI and high-performance computing.
Biwin Storage Technology is investing $672 million to advance its chip packaging capabilities as Chinese memory manufacturers shift toward more complex production models.
BOE Technology has launched a pilot production line for glass-based packaging substrates and delivered 24-layer samples to customers for testing.
Nordson Electronics Solutions has unveiled the ASYMTEK Vantage XL, a new fluid dispensing platform for panel-level semiconductor packaging, alongside strong fiscal Q3 2026 financial results.
Samsung and Qualcomm are partnering on 2.1D advanced packaging technology to create high-performance, cost-effective interconnect solutions for next-generation AI chips.
Samsung Electro-Mechanics and Qualcomm are developing a 2.1D advanced packaging technology for AI chips using cost-effective organic bridges.
TSMC aims to more than double its CoWoS advanced packaging capacity by 2028 as surging AI chip demand forces major clients to seek alternative suppliers.
