BOE Technology has successfully completed the full integration of its pilot production line for glass-based packaging substrates. The company has already delivered 24-layer products to clients for validation purposes.
The 24-layer substrates measure over 100x100 millimeters and have passed internal reliability testing at the company's facilities. Currently, BOE is conducting electrical performance tests by integrating these substrates with actual CPU and GPU chips for server operations.
Chairman Chen Yanshun stated that the decision to move to mass production depends on client order volumes and yield rates. The company aims to meet the necessary criteria for large-scale manufacturing investment by the first quarter of 2027.
BOE has also signed a memorandum of understanding with Corning to collaborate on glass-based packaging substrates, foldable glass, perovskite glass substrates, and optical interconnect applications. The pilot line currently has a design capacity of 1000 units per month.
