BOE Technology Group has announced the successful development of a full manufacturing process for glass-based packaging substrates. The company has mastered key technical stages, including high-aspect-ratio TGV drilling, copper filling, low-stress metal wiring, multi-layer lamination, and high-density routing.
The company's pilot production line is now fully automated. BOE has already produced and sampled 24-layer glass-based substrates with dimensions exceeding 100x100mm. These samples have successfully passed reliability testing protocols, confirming the maturity of the current manufacturing capabilities.
The pilot line, which reached full automation in the first half of 2026, has a designed production capacity of 1,000 units per month. BOE is currently evaluating the transition to mass production based on customer order volumes and yield stability.
Chairman Chen Yanshun stated in September that the company aims to meet the necessary investment criteria for mass production by the first half of 2027. The primary goal is to reach these decision-making milestones by the first quarter of 2027.
