Biwin Storage Technology is investing ¥4.5 billion ($672 million) into a project focused on advanced chip packaging and testing. This initiative represents the third phase of development at the company's facility in Dongguan, Guangdong province. The first two phases of the project required a total investment of ¥3.09 billion ($461 million).
The facility is currently in the stage of providing samples to customers, verifying processes, and producing small batches. By the end of 2027, the company expects to increase its monthly production capacity to 10,000 silicon wafers, which is more than triple the current output. Biwin is also developing fan-out technology for multi-layer memory and chiplet layouts that combine memory and logic.
Other Chinese manufacturers are also expanding their capabilities. Shenzhen Longsys Electronics has established capacity to produce over 1 million miniature SSDs per month using System-in-Package (SiP) technology. This approach integrates controllers and flash memory into a single package to save space in AI-powered PCs.
Analysts note that Chinese memory module suppliers are moving away from simple assembly models. Advanced packaging is becoming a critical factor for performance, reliability, and integration, particularly as AI hardware demands higher memory capacity and bandwidth. The global market for advanced chip packaging services is projected to grow from $46.1 billion in 2024 to $79.4 billion by 2030.
