AMEC has officially delivered its first Primo Matrix plasma wafer dicing system to a major domestic integrated circuit packaging client. This equipment is designed to address the growing demand for high-precision, low-damage processing in advanced packaging, which is critical for maintaining chip yields and production efficiency.
The Primo Matrix system utilizes the company's proven plasma deep silicon etching technology. It features a dual-station etching chamber and a wafer transfer module, supporting both 200mm and 300mm wafers with frames. The system is capable of handling wafer thicknesses ranging from 25 to 700 micrometers, accommodating both ultra-thin and standard configurations.
The equipment supports cutting street widths as small as 5 micrometers, which helps minimize wafer area loss and increases chip output. The system can be configured with up to six etching stations to handle long process times and supports various techniques, including front-side plasma dicing for bumped wafers and post-laser grooving processes.
AMEC currently provides etching solutions for processes ranging from 65nm down to 3nm, with aspect ratios reaching 140:1 for silicon etching. The company aims to expand its product portfolio over the next five years to cover more than 60% of the high-end semiconductor equipment market and over 70% of the advanced packaging equipment market.
