Nordson Electronics Solutions introduced the ASYMTEK Vantage XL, a precision fluid dispensing platform, at SEMICON Taiwan 2026. The hardware is designed for panel-level packaging, catering to the growing demand for large-scale semiconductor manufacturing driven by AI and high-performance computing.
The new platform supports panels up to 510 by 515 millimeters, offering a larger format than the previous Vantage series. It includes specialized features such as thermal management, warpage mitigation, multi-fiducial alignment, and confocal height sensing to ensure precision and quality control during the packaging process.
Nordson reported fiscal Q3 2026 adjusted earnings per share of $3.25, surpassing market expectations. Following these results, the company increased its full-year sales guidance to a range of $3,035 million to $3,075 million.
The company validated its technology through a collaboration with Powertech Technology, Inc. (PTI). Demonstrations conducted between late 2024 and 2025 using the standard Vantage platform and IntelliJet jetting technology achieved underfill yields of over 99%.
Alongside the Vantage XL, Nordson showcased the MARCH ExoSPHERE plasma treatment system at the event. This system is intended for uniform surface preparation of panels and wafers, serving as an additional component in the advanced packaging workflow.
