TSMC has officially launched mass production of advanced packaging with a 5x reticle size. CEO C.C. Wei confirmed that the company is currently achieving excellent yields with this technology, noting that no other manufacturer has reached this scale yet.
The company is already working on further scaling its packaging capabilities. Development is underway for 9x reticle size solutions, with a long-term roadmap targeting 14x reticle sizes by 2029. Current 5.5x CoWoS packaging has reached high production volumes with yields consistently exceeding 98%, and in some cases reaching 99%.
TSMC is positioning itself to support clients facing capacity constraints elsewhere. CEO C.C. Wei stated that the company is prepared to step in if customers cannot secure sufficient advanced packaging capacity from competitors, prioritizing the successful market launch of client products.
