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Hardware

IBM and Siemens Partner on 0.7 nm Nanostack Chip Design Tools

IBM and Siemens are collaborating to prepare engineers for 0.7 nm chip design using the new 3D Nanostack architecture, with a pilot design kit expected in early 2027.

October 15, 2026, 10:24 PM·3DNews - Daily Digital Digest
Money

Synopsys Eyes Chinese AI Integration for Chip Design

Synopsys plans to integrate local AI models into its chip design tools for the Chinese market to bypass regional restrictions while maintaining compliance with US export laws.

3DNews - Daily Digital Digest
AI

Synopsys Partners With OpenAI Amid China Rumors

Synopsys has announced a strategic partnership with OpenAI to develop the GPT-Synopsys AI model, while dismissing unconfirmed reports regarding collaborations with Chinese AI labs.

Crypto Briefing
Hardware

The Evolution of AI in Semiconductor Design

AI is shifting from a simple optimization tool to an active participant in semiconductor development, automating RTL generation, verification, and architectural exploration for next-gen chips.

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