TSMC reported a 41.2% year-over-year revenue increase to $46.72 billion for Q3 2026, driven by sustained demand for high-performance computing and AI-related chip production.
Bitdeer Technologies Group has scheduled the rollout of its AI cloud capacity, targeting 67 MW by Q2 2027 as part of a broader plan to reach 350 MW by early 2028.
Nvidia's Vera server processors have outperformed leading AMD and Intel chips in HPC benchmarks, driven by superior memory bandwidth.
NVIDIA's Vera CPU is being tested against AMD EPYC and Intel Xeon processors in high-performance computing workloads to evaluate its capabilities and power efficiency.
TeraWulf has doubled its contracted power capacity to 1 GW at the Muskie Data Campus in Kentucky, with long-term plans to scale the site to 2 GW for AI and HPC workloads.
French supercomputer maker Bull SAS has doubled its monthly production capacity to 12 racks following an €80 million factory expansion in Angers.
Rosatom's research center has developed a high-performance computing communication system capable of reaching speeds of 200 Gbps.
Samsung Electronics aims to quadruple its foundry client count by 2029 while shifting its core focus toward high-performance computing and AI applications.
