Intel has patented a method for embedding micro-LEDs into CPU packaging using glass substrates to enable surface illumination and status signaling.
Intel has patented a CPU packaging technology that integrates micro LEDs into glass substrates, potentially enabling new optical communication or illumination features.
Intel has patented a method for embedding Micro LED lights directly into CPU packaging to display real-time status indicators or custom visuals.
Avicena has unveiled the LightBundle eKit, the world's first connectorized Micro LED optical interconnect, at the ECOC 2026 conference.
Ningbo Qiushui Semiconductor has launched a mass-produced 8-inch red light Micro LED chip for AR glasses and near-eye displays.
