Intel has received a US patent, number 12,733,303, for a semiconductor package featuring integrated micro LEDs. The design involves embedding these LEDs into a glass substrate, utilizing through-glass vias to provide power and connectivity to the package.
The patent, filed in 2022, details the use of nanowire structures within the LEDs to produce red, green, and blue light. Potential applications mentioned include surface illumination, user customization for DIY electronics, and internal indicators for electrical testing.
While the patent focuses on lighting, industry reports suggest potential links to optical data transmission. AU Optronics is currently developing micro LED co-packaged optics for AI data centers, with rumors circulating about a possible collaboration between the two companies.
Intel has previously adjusted its strategy regarding glass substrate development. Last year, the company shifted from internal R&D to a licensing model. In January, Intel demonstrated a glass core substrate with EMIB technology at the NEPCON Japan exhibition.
