Intel has disclosed a patent detailing the integration of micro-LEDs directly into CPU packaging. The technology, filed in 2022, involves embedding semiconductor chips and micro-LEDs into a glass substrate, utilizing through-glass vias (TGV) to transmit power and signals to the components.
The micro-LEDs can connect to the processor either directly or via nanowires. The design allows for the display of illuminated text, status indicators, or diagnostic information on the chip surface. These LEDs are capable of emitting red, green, and blue light, enabling potential RGB lighting effects or functional signaling.
The patent describes a structure where the glass substrate is positioned between two packaging layers. Manufacturing involves laser-induced and chemical etching to create vias, followed by copper plating for vertical interconnects. Intel suggests that this configuration could support multiple LEDs across one or more chip packages.
Intel has been developing glass substrate technology for several years, claiming it offers an interconnect density approximately 10 times higher than organic substrates. While the patent explores decorative and functional applications, the company notes that the technology is not yet slated for commercial release.
Practical implementation remains a challenge, as standard processors are typically covered by heat sinks. The patent does not specify how the illumination would remain visible to users in a functional computer setup, leaving the integration of these features as an ongoing area of research.
