South Korean PCB manufacturer TLB has begun preliminary discussions with two existing memory module clients regarding the design and production of the SOCAMM3 standard. The parties involved have not yet finalized the technical specifications for the new modules.
The mass production of SOCAMM3 is currently scheduled to commence in 2028. Industry reports suggest that these modules may enter the market alongside the upcoming NVIDIA Rosa CPU platform.
Technological requirements for the new standard are increasing. While the current SOCAMM2 modules require a five-layer stacking lamination process, the SOCAMM3 design will necessitate a higher number of layers, complicating the manufacturing of micro-vias for layer interconnection.
