Researchers at Lobachevsky University have patented a new method for purifying silicon dioxide nanopowder. This material is a key component in polishing suspensions used for semiconductor wafer manufacturing. The technology allows for precise control over particle size, shape, and uniformity while minimizing impurities.
The project, which began in 2024 under the Priority-2030 federal program, focuses on developing advanced materials for microelectronics. The team has finalized the synthesis conditions and composition. Currently, the researchers are scaling the technology and conducting tests with an industrial partner.
According to project lead Ksenia Otvagina, the method enables the production of materials with specific characteristics required for stable and accurate wafer processing. The initiative aims to reduce reliance on foreign suppliers by providing domestic alternatives for high-purity abrasive nanomaterials.
