Huawei has implemented a vertical stacking architecture in its Kirin 9050 Pro processor to increase component density without shrinking transistor sizes.
Huawei's new Kirin 9050 Pro processor, built on the LogicFolding architecture, has outperformed the 3-nm Apple A17 Pro in multi-core benchmarks, narrowing the tech gap to three years.
Huawei is coordinating the development of Chinese DUV lithography systems by Yuliangsheng, which are currently being tested by SMIC for chip production.
Huawei aims to capture 50% of China's AI chip market by 2026 by doubling production and implementing novel chip architectures to bypass US export controls.
