Huawei has publicly unveiled its Kirin 9050 Pro processor, which utilizes a 3D LogicFolding architecture to bypass manufacturing limitations.
Huawei is developing domestic EUV lithography technology while utilizing its proprietary LogicFolding 3D packaging to maintain performance without advanced manufacturing nodes.
Qualcomm has signed a licensing deal with Huawei worth $6.9 billion to integrate LogicFolding and other technologies into its product portfolio.
Huawei has unveiled its Mate 90 smartphone series featuring new Kirin processors, including the first models manufactured with the multi-layer LogicFolding technology.
