Huawei officially showcased the Kirin 9050 Pro processor at the Device Innovation Technology Communication Event. This chip is already utilized in the Mate XT 2 tri-fold smartphone and high-end models of the Mate 90 series, though it had not been publicly displayed until now.
The processor features the HiSilicon brand and the year 2035 marking, with gold contact strips along the edges. It employs a 3D architecture known as LogicFolding, which stacks two dies vertically. This design aims to increase transistor density and performance without expanding the chip's physical footprint.
According to Huawei Central, the LogicFolding technology enables a 28% increase in transistor density and a 42% boost in performance compared to the previous generation. The company developed this multi-layer approach to overcome limitations imposed by US sanctions and the lack of access to advanced EUV lithography equipment.
The exhibition also featured other components of the Mate XT 2, including the octagonal camera frame, a textured back panel, and Tiantong hinge plates. Huawei shifted its focus toward developing proprietary platforms several years ago following the introduction of US supply restrictions.
