Vinci4D Inc., based in Palo Alto, California, has secured $250 million in a Series B funding round, reaching a valuation of $1.5 billion. The investment round was led by Advent, Temasek, and Xora, with participation from several funds, including AMD Ventures.
The company provides a software platform for engineering simulations, initially focusing on chip design. It allows engineers to simulate thermal properties of processors, memory modules, and interconnects. The platform uses a physics-focused artificial intelligence model to automate the creation of simulations from CAD drawings.
The software automates the meshing process and utilizes custom graphics card kernels to accelerate simulation calculations. According to the company, the platform can process simulations containing hundreds of millions of degrees of freedom in a few minutes, a task that typically requires hours or days.
Vinci plans to expand its simulation capabilities beyond semiconductor projects to include vehicles, aircraft, and satellites. CEO Hardik Kabaria stated that the company aims to enable engineers to understand physical behavior during the design phase and eventually build systems that suggest design changes.
