The United Microelectronics Company (UMC) plans to build three facilities for semiconductor production, assembly, and testing. The primary project is a factory capable of processing 300mm silicon wafers with 14nm technology, scheduled for completion by 2036. Pre-project work and process development are set to begin in 2027 and conclude by 2029.
Two additional facilities will support the production chain. A module assembly plant, focusing on power supplies and navigation systems, is expected to launch in late 2028. A second facility, operating under the OSAT model for chip packaging and testing, is slated for completion in 2031. Industry estimates suggest the 14nm factory could cost $10 billion.
The total investment program for UMC is projected at 1.101 ₽ trillion through 2036. Of this, 1.031 ₽ trillion is allocated for production capacity, 50 ₽ billion for chip design, and 20 ₽ billion for a technology fund. Funding will be provided by the state and Sberbank, with 170 ₽ billion earmarked for 2027 and 161 ₽ billion for 2028.
UMC aims to consolidate Russian microelectronics assets, including Micron and NM-Tech. While the project timeline is separate from existing NM-Tech initiatives, the strategy seeks to create a vertically integrated production cycle. Experts note that securing specialized semiconductor equipment remains a significant challenge for achieving 14nm production goals.
