Samsung and Qualcomm have developed a new 2.1D packaging technology for AI chips, utilizing organic materials instead of traditional silicon, glass, or ceramics. This approach, derived from printed circuit board manufacturing, employs layers made of resin or polymers to connect multiple chip dies.
The organic bridge technology aims to reduce production costs and accelerate the assembly process for AI processors. By replacing inorganic materials, the method improves bandwidth and simplifies mass production, while simultaneously addressing supply chain constraints associated with silicon components.
The development of this technology traces back to a patent application filed in October 2024. Samsung is currently collaborating with Qualcomm on the project, though other companies have also expressed interest in 2.1D packaging solutions for data center applications.
The industry is seeing increased competition in advanced packaging, with Intel and TSMC also developing similar solutions at various stages of readiness. This innovation is expected to support the growing demand for high-performance computing hardware in global data centers.
