Qualcomm and Huawei have signed a multi-year cross-licensing agreement. The deal grants Qualcomm access to Huawei's LogicFolding technology, which is currently utilized in the Kirin 9050 Pro SoC, the processor powering the Mate 90 Pro Max smartphone.
LogicFolding, introduced by Huawei several months ago, improves SoC performance through a vertical stacking architecture. The system combines two dies: a bottom layer for computing and a top layer for cache and SRAM. This design increases transistor density and memory capacity without significantly enlarging the chip footprint.
The technology serves as a strategic alternative for Huawei amid US export restrictions that limit access to ASML's EUV lithography systems. By focusing on advanced packaging and 3D chip stacking, Huawei aims to boost performance without relying solely on shrinking process nodes.
The agreement is subject to review by the US Federal Trade Commission under the Hart-Scott-Rodino Act. While the two companies have a long history of cooperation, Huawei has recently accelerated its shift toward proprietary processors and domestic manufacturing in response to tightening sanctions.
