Singapore-based startup Nexstrom is developing manufacturing equipment and processes to produce transition-metal dichalcogenides (TMDs) directly on 300mm chip wafers. The company aims to address the limitations of silicon transistors by utilizing these thin 2D materials to improve chip performance and reduce power loss.
The startup's technology, branded as North Star, is based on research by co-founder and chief scientist Lance Li. Nexstrom has successfully scaled material production from 2 inches to 6 inches and expects to reach 8 inches by the end of October. The company is currently focused on meeting quality specifications for industry partners.
Nexstrom recently secured $12 million in a seed funding round led by Xora, Foothill Ventures, and SEEDS, bringing its total funding to $15 million. The company intends to use these funds to enhance process control, expand its team, and support qualification programs with potential customers.
Rather than competing with major chipmakers like TSMC, Samsung, or Intel, Nexstrom plans to license its technology or form partnerships. The startup anticipates that its equipment will be ready for commercial production between 2030 and 2035.
