Researchers at North Carolina State University have developed a thin-film material that combines high rigidity with low thermal conductivity. The material is based on two-dimensional hybrid organic-inorganic perovskites, specifically an azobenzene-ethylammonium-lead-iodine compound.
The material exhibits a thermal conductivity of approximately 0.04 W/(m·K) at room temperature, compared to 0.2 W/(m·K) for standard silicone. It is also 700 to 10,000 times stiffer than silicone. Unlike most effective insulators, this film is non-porous.
The team achieved these properties by replacing traditional carbon chains with benzene rings in the molecular structure. This modification suppresses the vibrations that carry thermal energy while maintaining a rigid crystalline framework.
The researchers suggest the material could be applied to large surfaces or used as a protective coating in electronics and aerospace. However, the presence of lead in the composition may limit its use in certain applications.
The technology is currently in the early stages of development. Future research will focus on assessing the material's durability, production costs, long-term stability, and performance under various operating conditions.
