GlobalFoundries has entered into a five-year agreement with TSMC valued at $2 billion. The contract focuses on the production of silicon interposers for TSMC's CoWoS-S packaging ecosystem at the GlobalFoundries facility in Malta, New York.
The manufacturing expansion is scheduled to begin in the first half of 2028. GlobalFoundries will act as a subcontractor, producing custom interposers that connect logic chiplets and high-bandwidth memory stacks for AI and high-performance computing processors.
This partnership aims to strengthen the semiconductor supply chain within the United States. By offloading some interposer production, TSMC intends to increase the availability of components required for its advanced packaging technologies.
The agreement provides a framework for future capacity expansion based on market demand. However, the companies have not disclosed specific production volumes, capital expenditure details, or the exact financial breakdown of the deal.
This collaboration aligns with broader industry efforts to establish a domestic supply chain for advanced AI processors by 2029–2030, involving companies like Amkor Technology and potential HBM assembly facilities in the U.S.
