TSMC is accelerating the construction of its 1.4nm semiconductor manufacturing facility in Taichung. According to reports, the company has moved up its production timeline by approximately one year, with trial production now expected to begin in April 2027.
The Taichung Phase II expansion project includes four separate factory buildings. Construction on the first facility is underway, with the steel structure completed and floor and wall assembly in progress. This site is slated to transition to mass production in the second half of 2027.
The second facility, known as P2, has finished its concrete foundation work, and the construction team is currently erecting the steel structure. If the current schedule holds, this building will be fully completed by October 2025, with mass production potentially starting in October 2027.
Development of the third and fourth facilities is in the early stages. TSMC has already secured a construction permit for the third building and is in the process of applying for the fourth. Local authorities expect these two plants to be finished in 2028, with a six-month interval between their completion dates.
