Terafab, a joint venture between Tesla and SpaceX, has outlined ambitious production targets to become a major memory chip manufacturer by 2032. The company aims to process 1 million wafers per month, with 700,000 allocated for memory chips and 300,000 for logic components.
The firm plans to operate a single facility in Texas. A pilot fabrication plant is expected to be completed by July 2027. Intel is reportedly providing technical support for logic production, utilizing its 2 nm and 1.4 nm-class technologies, while a Taiwanese firm is considered as a potential partner for memory development.
Elon Musk noted that volume production may begin by the third quarter of 2028, though he emphasized significant uncertainty regarding this timeline. A preliminary SRAM test chip is scheduled for development at the company's research laboratory in Austin by mid-2027.
For comparison, the projected output of 1 million wafers per month aligns with the long-term goals of SK Hynix, which aims to reach that volume by 2030 or 2031. Samsung's total DRAM production was estimated at 650,000 to 700,000 wafers per month late last year.
