SK Hynix has received the TSMC Partner of the Year award in the 3DFabric-HBM integration category for the second consecutive year. The recognition follows the successful validation of the company's HBM5 memory on TSMC's CoWoS 2.5D advanced packaging platform.
The award was presented during the TSMC 2026 North America Open Innovation Platform Ecosystem Forum held on September 23. At the event, SK Hynix showcased new high-performance memory products, including the 12Hi 48GB HBM4E.
During the forum, SK Hynix engineer Park Daesik announced that the company is developing chiplet-based controller solutions for PCIe Gen6 and Gen7 solid-state drives. This design approach splits the main controller into functional modules connected via UCIe to accelerate development cycles.
According to company projections, the enterprise SSD market is expected to grow significantly in the coming years. The market volume is forecast to rise from 509EB in 2026 to 1933EB by 2030, representing a 3.8-fold increase.
