SK hynix is reportedly encountering technical obstacles in the development of hybrid bonding technology for its HBM memory products. According to an engineer from the company's future technology research institute, these challenges have delayed the production of initial samples.
In contrast, Samsung has allegedly already distributed samples of HBM chips produced with hybrid bonding to its customers. This development marks a potential shift in the competitive landscape, as SK hynix currently leads the global market in HBM revenue.
Hybrid bonding technology replaces traditional chip bumps with direct copper interconnections between silicon chips. This method allows for the stacking of multiple dies or wafers, which reduces signal latency and improves overall performance by shortening the distance between components.
