The ongoing AI boom has triggered a significant shortage of equipment and components required for semiconductor manufacturing. According to TrendForce and ETNews, delivery lead times for major components have more than doubled. This surge in demand is driven by massive investments from US hyperscalers like Microsoft, Google, and Amazon in AI infrastructure.
Major equipment vendors such as Applied Materials, ASML, Lam Research, Tokyo Electron, and KLA have seen lead times increase by 1.5 to 2 times as of July 2026. While orders previously took about six months to fulfill, the process now extends up to 12 months. Components for thin-film deposition equipment now require up to 10 months, compared to the previous four-month window.
Japanese suppliers of laser processing components face the longest delays, with lead times reaching 40 months. Meanwhile, packaging equipment delivery times have risen from four months to at least six. Manufacturers are struggling to scale production, as they failed to anticipate the AI-driven demand and are now hesitant to invest in capacity expansion due to market uncertainty.
China Securities Research reports a global price increase for semiconductor manufacturing components. Analysts estimate that expanding production lines for these parts takes between 1 and 1.5 years. Additionally, non-Chinese suppliers are experiencing delays in delivering valves, piping components, ceramic parts, RF power sources, and gas blocks, impacting major manufacturers like Samsung and SK Hynix.
