Micron has introduced 512GB DDR5-9200 RDIMM memory modules, utilizing advanced vertical stacking and through-silicon vias. The modules operate at a data transfer rate of 9200 MT/s at a standard 1.1V voltage.
The company reports that a single 512GB module consumes 16W of power, which is over 60% less than the 44.2W required for four 128GB modules. These components are designed for high-performance server environments, including AI and in-memory databases.
Micron states that systems using these 512GB modules can achieve up to 1.4 times the performance of configurations with 256GB modules in specific analytics workloads. The hardware is intended to support future servers with high core counts, potentially enabling up to 12TB of total system memory.
AMD and Intel are currently collaborating with Micron to qualify the new modules for upcoming server platforms. Volume production is scheduled to commence in the second half of 2027, with timelines adjusted based on specific customer demand.
