Micron Technology has announced new 512 GB RDIMM DDR5 memory modules, designed specifically for server environments. These modules support operating speeds of up to DDR5-9200. The company utilizes TSV vertical stacking technology to achieve this high density on a single module.
The modules are currently undergoing validation by Intel and AMD. Micron plans to begin mass production in the second half of 2027. A dual-processor server equipped with 24 memory slots can reach a total capacity of 12 TB of DDR5 RAM using these new components.
According to Micron, the 512 GB modules reduce power consumption by 60 percent compared to using four 128 GB modules to achieve the same total capacity. Furthermore, the new memory improves performance in data analysis tasks, such as Spark SVM, by up to 1.4 times compared to 256 GB modules.
Intel has confirmed that its next-generation server platforms will support these high-capacity modules. The memory also demonstrates increased efficiency when handling data processing workloads in databases like RocksDB and Redis.
