Micron Technology has unveiled the industry's first 512GB DDR5 RDIMM server memory module. The device utilizes vertical DRAM die stacking, which allows for increased capacity without requiring additional physical space on server motherboards.
The module supports a maximum data transfer rate of 9,200 MT/s. In a dual-socket server configuration with 24 slots, this enables a total system memory capacity of up to 12TB. Micron reports a 1.4x efficiency gain for specific Spark SVM analytics tasks.
Power efficiency is a key feature, with each 512GB module consuming 16W. This represents a reduction of over 60% compared to the 44.2W consumed by four 128GB modules. The design is intended for AI workloads and high-density virtualization.
Volume production is scheduled for the second half of 2027, aligning with upcoming server platforms from AMD and Intel. Both companies are currently validating the design. Following the announcement, Micron shares rose by approximately 1.2% to 1.4%.
