Researchers at Lobachevsky University have patented a new method for the deep purification of silicon dioxide nanopowder. This material is essential for creating polishing suspensions used in the manufacturing of modern semiconductor wafers.
The project, which began in 2024 under the federal Priority-2030 program, has reached the stage of pilot technological testing. The team has developed a production line and established a formal manufacturing protocol for the product.
The technology allows for the creation of particles with specific dimensions, shapes, and high uniformity. These characteristics are critical for ensuring the reliability and performance of electronic components during the chemical-mechanical polishing process.
As of October 2026, the developed suspension is undergoing testing with an industrial partner. The university aims to scale the process to support the domestic microelectronics industry and reduce reliance on foreign suppliers.
