Intel has officially commenced the installation of manufacturing equipment at its Fab 62 facility, located within the Ocotillo campus in Chandler, Arizona. The company is currently conducting construction and equipment setup simultaneously, aiming to bring the plant into operation by the end of 2028. This site represents the sixth high-capacity manufacturing facility at the Ocotillo location.
While Intel has not yet disclosed specific process nodes for Fab 62, the adjacent Fab 52 facility is already utilizing the 18A process. This technology incorporates RibbonFET gate-all-around transistors and PowerVia backside power delivery. Intel reports that the 18A process reached high-volume production in 2025. The company has not confirmed if Fab 62 will focus on 18A, 18A-P, or 14A nodes.
Intel is also expanding its footprint elsewhere in the United States. The Ohio One campus in New Albany has installed the first structural truss for its initial wafer fab. Additionally, the company has broken ground on a new photomask manufacturing facility in Santa Clara, California. Photomasks are essential components for transferring circuit patterns during the lithography process.
Furthermore, reports indicate that Intel is in discussions with SK Hynix regarding a potential lease of space at the Ohio One site. The proposed partnership would involve manufacturing memory chips within the facility. Neither company has officially confirmed the negotiations, and details regarding the scope of the lease or specific operational timelines remain undisclosed.
