Helion has secured $175 million in federal funding under the CHIPS Act to advance semiconductor and power electronics development. The three-year initiative aims to minimize energy losses during transmission, which currently account for 5–10% of output. CEO David Kirtley stated that halving these losses could potentially double the power generation capacity of the company's fusion reactors.
The capital allocation includes over $100 million for research and advanced packaging in Washington, and approximately $80 million for process development in Vermont in partnership with GlobalFoundries. Additionally, Helion disclosed a separate $50 million private investment, bringing its total funding to over $3.2 billion.
The company's fusion technology generates electricity directly from plasma expansion against magnetic fields, bypassing traditional steam turbines. High-voltage pulse management via semiconductors is critical to this process. While these new components will not be integrated into the initial Orion reactor, they are intended to enhance future installations.
Helion maintains its commitment to supply electricity to Microsoft by 2028 through the Orion project. Beyond fusion energy, the company anticipates that these semiconductor advancements could serve broader applications, including industrial equipment, power transmission systems, and the electric vehicle sector.
