At the 2026 Global AI Chip Summit, HOUMO.AI announced that its upcoming edge AI chip for large models will utilize a 3D CIM architecture. This design integrates computing-in-memory with 3D DRAM technology to enhance performance.
The company claims that vertical stacking allows the new flagship chip to deliver double the computing power within the same footprint. This approach is also expected to improve power efficiency and thermal management during real-time edge interactions.
In July 2025, HOUMO.AI launched the M50 chip, which features a typical power consumption of 10W. It provides 160TOPS for INT8 operations or 100TFLOPS for bFP16, alongside 48GB of memory and a bandwidth of 153.6GB/s.
The M50 chip has already secured design wins in over 150 different products, demonstrating its versatility across various application scenarios.
