TrendForce analysts forecast a 121% increase in the average selling price of HBM memory in 2027 compared to 2026. This growth is driven by persistent market shortages, the rising share of expensive HBM4 chips, and the introduction of advanced HBM4E memory in the second half of the year.
The price of a 12-layer 36 GB HBM4 chip is expected to rise from approximately $600 in 2026 to $1300 next year. Micron Technology has already allocated its HBM supply quotas for 2027, noting that prices will be significantly higher than current levels to improve production profitability.
In the second quarter of 2026, Samsung increased its HBM market share from 21% to 33% in value terms. During the same period, SK hynix saw its share decline from 58% to 50%, while Micron's share dropped from 21% to 18%. Samsung is currently expanding its HBM4 offerings.
Manufacturing HBM remains complex due to the high demand for silicon wafers, as each stack utilizes 12 to 16 dies. Samsung estimates that the share of global DRAM production capacity dedicated to HBM will grow from 20% in 2026 to nearly 30% in 2027, forcing manufacturers to balance HBM output with server DDR demand.
