GlobalFoundries (GF) has entered into a multi-year manufacturing agreement with TSMC to establish a US-based supply of silicon interposers. The deal is valued at $2 billion and aims to support TSMC's CoWoS advanced packaging ecosystem.
Under the terms of the agreement, GF will expand capacity at its manufacturing facility in Malta, New York. This initiative is designed to meet the rising demand for artificial intelligence and high-performance computing technologies.
The expansion will enable the production of advanced packaging components, including embedded deep trench capacitor technology. This move is intended to provide greater scale and flexibility for multi-generational product solutions.
GF plans to begin ramping up volume production at the Malta site in the first half of 2028. The contract has an initial term of five years and includes a framework for potential future capacity increases.
