Hubei Xingchen Technology has officially launched the second phase of its chip packaging platform in Wuhan. This facility is recognized as the first mass-production line for 3D chip packaging in China, with the first batch of wafers already completed.
The project required a total investment exceeding ¥7 billion for both phases. Construction of the second phase began in October 2025, with the main building completed in March 2026 and equipment installation starting in June 2026.
The production line is designed to handle pilot and trial manufacturing for 40 to 50 types of chips simultaneously. It will also serve as a testing ground for 30 to 40 sets of domestic equipment and materials.
The platform focuses on AI accelerators, smart devices, memory-computing chips, and optoelectronic integration. The company expects to reach a full production capacity of approximately 20 000 wafers per month by the first quarter of 2027.
