ACM Research Shanghai has shipped its first mass-production 310mm by 310mm panel-level horizontal plating system, the UltraECP ap-p, to an Asian market outside mainland China.
The equipment utilizes proprietary horizontal plating technology to support various materials, including copper, nickel, tin-silver, and gold. The copper plating chamber features high-speed paddles designed for high copper pillar applications, enabling uniform grain structure and high plating rates for 300-micron pillars.
To ensure reliability and performance, the system incorporates a four-sided sealed dry contact chuck. It also includes an in-chamber cleaning function to mitigate cross-contamination between chemical processes.
The machine employs a patented design that combines a synchronously rotating chuck with a rotating rectangular electric field. This configuration is intended to achieve consistent film thickness across large-size substrates, which is critical for advanced packaging manufacturing.
