Tencent plans to raise up to $5 billion through an offshore bond sale to fund its expanding artificial intelligence infrastructure and capital expenditures.
Major US banks are aggressively increasing debt issuance to capitalize on the massive demand for AI infrastructure financing from big tech companies.
Goldman Sachs warns that massive AI infrastructure spending by major tech firms is driving up capital costs and creating a significant funding gap.
Softline is preparing a bond issuance of at least 3 ₽ billion to refinance debt and optimize its financial structure.
The US Treasury will auction $69 billion in 2-year notes on September 22, maintaining its consistent 2026 debt financing strategy amid stable investor demand.
The US Treasury issued $171 billion in short-term debt on September 8, with 26-week bills attracting higher demand than 13-week instruments.
Securitized lending for data centers is projected to reach $30 billion in 2025, forcing investors to navigate new risks and a significant debt maturity wall.
Goldman Sachs reports that its high-yield AI datacenter credit basket is trading at a 353 basis point spread as the market faces nearly $500 billion in new AI-related debt.
The share of US Treasury debt held by central banks and the Fed has fallen below 15%, shifting market control to private investors and signaling higher borrowing costs.
Tech giants have issued $320 billion in debt in 2026, competing with US Treasuries and potentially impacting market yields.
