Hardware
Samsung and Qualcomm Partner on 2.1D Organic Chip Packaging
Samsung and Qualcomm are partnering to develop 2.1D chip packaging technology using organic bridges to connect silicon dies.
September 14, 2026, 06:22 PM·TechPowerUp
#chip-packaging
Hardware
Huahai Qingke Launches Mass Production of Panel-Level CMP Equipment
Huahai Qingke has deployed its first domestic fully automated panel-level CMP equipment, the Master-P510APEX, into mass production lines.
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